European Conference on EDGE AI Technologies and Applications – EEAI

Advancing emerging edge AI

technologies and driving next
generation intelligent applications.

17-19 October 2023, Athens, Greece

Digital Industry

Digitised control systems with advanced sensing, automated defect classification, virtual metrology and the implementation of a digital tacit knowledge platform are the clear vision for semi- autonomous AI supported production environment for a sustainable and resilient European Digital Industry.


To develop advanced distributed edge AI technologies for applications and services at the intersection of mobility, energy and building industrial sectors to support the European stakeholders driving the engine for innovation and entrepreneurship in sustainable energy.

Agrifood and Beverage

To develop technologies, procedures, and AI algorithms to make European agri-food and beverage industry globally renowned for its leadership, resilience, and contribution to climate neutrality.


To develop edge AI-based perception, cognition, and monitoring technologies to advance the mobility sector in three different aspects: the mobile agent (e.g., drones, UAVs, UGVs and other vehicles), stationary and mobile multi-agent collaboration (distributed edge intelligence), and infrastructure.

Digital Society

Digital society requires the closer integration of technological systems and human users. This requires those systems to accurately interpret real world stimuli, inferring activity and intention. Such stimuli are poorly differentiated, indistinct, and contradictory.












EdgeAI Objectives

The EdgeAI strategic goals are realised through a set of strategic objectives, as illustrated in Figure 1-4. These objectives reflect the way in which EdgeAI consortium delivers processing solutions for AI at the edge addressing the design stack and middleware across multiple industrial sectors including mobility, digital industry, energy, agri-food and environmental protection and digital society.

EdgeAI developments implement applications across the edge continuum (micro, deep, meta-edge), to deploy functionality defined by processing requirement, latency, reliability, energy efficiency and performance.

Objective 1

Develop secure AIbased
edge platforms for endto
end hardware/software
solutions addressing the AI
design stack and


Objective 2

Provide scalable edge AI
based energyefficient
techniques, methods and
frameworks supporting
different OSs and hardware


Objective 3

Advance multi core SoC and
SoM AIbased designs with
embedded hybrid
architectures, connectivity
and IIoT devices for
industrial environments.


Objective 4

Integration of scalable and
modular AI Codesign:
algorithms, topologies into
novel AI open architecture


Objective 5

Implementation of
reconfigurable AIbased
architectures for increasing
the reuse, updatability,
upgradability and service life
of AI.


Objective 6

Provide trustworthy and
explainable edgeAI by
design solutions with real
time operation capabilities
and dynamic online


EdgeAI Value Chains

The EdgeAI project accelerates the edge AI-based digitisation of design, manufacturing, and business processes with edge AI integration throughout the complete edge continuum by implementing the edge AI technology developed in five value chains (VCs).

The five value chains (digital industry, energy, agri-food and beverage, mobility, and digital society) are focussed on common research topics delivering demonstrators in their respective fields. By harmonizing the development schedules of each value chain through the work packages the findings within each value chain are shared within the consortium, fostering knowledge exchange.

Latest News & Events

How transformers impact edge AI chip design

How transformers impact edge AI chip design

Transformers are making their way from generative AI and large language models down to embedded chips. Avi Baum, chief technology officer and co-founder of Hailo in Israel, talks to Nick Flaherty about the different use cases for transformer AI driving its third...

read more
New toolchain and software package from STMicroelectronics

New toolchain and software package from STMicroelectronics

STMicroelectronics has released a toolchain and accompanying software package for programming the intelligent sensor processing unit (ISPU) embedded in the latest-generation intelligent MEMS IMUs, ISM330IS and LSM6DSO16IS. The toolchain and software help employ...

read more
Network of Excellence Paves Way For Edge AI Technologies

Network of Excellence Paves Way For Edge AI Technologies

The European Network of Excellence ‘dAIEDGE’ promotes the application of Artificial Intelligence (AI) on edge computing platforms – Fraunhofer IGD is one of the project partners. By combining edge computing and AI (Edge AI), devices can make decisions in a few...

read more
Share This