European Conference on EDGE AI Technologies and Applications - EEAI

Conference Overview

21-23 October 2024, Cagliari, Sardinia, Italy

European Conference on EDGE AI Technologies and Applications – EEAI Overview

Edge artificial intelligence (AI) combines AI, the Internet of Things (IoT) and edge computing technologies to provide real-time data collection, processing, analytics, and decision-making. 

Cutting-edge AI technologies and applications are constantly evolving and driving intelligent control and decisions of the future by moving AI capabilities closer to the data source from the physical world to enable the implementation of autonomous systems.

Advancements in smart sensors, edge processing devices with novel processing architectures, artificial and spiking neural networks implemented through CPUs, GPUs, NPUs, TPUs, ASICs, FPGAs, system-on-chip (SoC), system-on-module (SoM), and neuromorphic accelerators support the development of edge AI.

The expansion of the micro-, deep-, and meta-edge continuum as part of the novel distributed AI-based computing architectures supports the emerging intelligent autonomous systems and applications across various industrial sectors.

The European Conference on Edge AI Technologies and Applications – EEAI brings together researchers, practitioners, and edge intelligence champions to convey and exemplify their perspectives on energy-efficient edge AI architectures, frameworks,  platforms and applications.

The conference addresses the edge AI foundations, applications, algorithms, hardware, software, communication networks, and systems. It showcases the latest advancements in these areas and provides an arena for debating and identifying future directions and challenges.

The European Conference on Edge AI Technologies and Applications aims to serve as an innovative edge AI platform for exchanging ideas and concepts. It will feature several leading representatives in research and industry who support the integration of edge AI technologies to advance future industrial applications.

Conference Topics

The topics of interest include, but are not limited to, the followings:

Edge AI Technologies

  • Edge AI tools and methods
  • AI hardware-software co-design methods and tools
  • Edge AI workflows and systems design
  • Edge AI auto ML
  • Architectures, frameworks, and protocols for intelligent edge processing
  • Machine vision: image classification, object detection, semantic segmentation
  • Edge AI natural language processing, speech recognition and synthesis
  • Energy optimisation for edge devices
  • Reconfigurable edge AI
  • Optimisation methods and techniques for neural networks
  • Multimodal learning implications for edge AI training and inference
  • Federated learning
  • Edge AI accelerators – GPUs, NPUs, TPUs, ASICs, FPGAs, etc.
  • Neuromorphic HW Architectures (digital, mixed signal, analog, spiking)
  • RISC-V-based edge AI hardware acceleration
  • Edge AI heterogeneous systems integration
  • Heterogeneous edge AI: integrating CPUs, GPUs, NPUs, and TPUs in edge devices to optimize AI workloads
  • Smart connectivity at the edge
  • Edge AI optimisation for 5G/6G
  • Edge AI for immersive technologies (XR/VR/AR/MR, metaverse/omniverse/multiverse)
  • Enhancing immersive experiences with real-time AI processing at the edge
  • Simulation and analysis techniques for edge intelligence
  • Human to edge AI interaction and its implications for privacy
  • Integrated hardware and software edge platforms
  • Generative edge AI
  • Transformers at the edge: data, hardware, and software engineering challenges
  • Sustainable edge AI technologies
  • Trustworthy edge AI (dependable edge AI systems – security, privacy, safety reliability, availability, maintainability, connectability, fairness, accountable, robustness, resilience)
  • Edge AI verification, validation and testing
  • Benchmarking edge AI models
  • Edge AI explainability and interpretability
  • Ethical implications of edge AI
  • Edge AI system holistic approach: converging hardware, software, AI technology stack and data


Technical Program Committee

Ovidiu Vermesan, SINTEF, Norway

Mario Diaz Nava, STMicroelectronics, France

Björn Debaillie, imec, Belgium

Marcello Coppola, STMicroelectronics, France      

Carmelo Pino, STMicroelectronics, Italy

Patrick Pype, NXP Semiconductors, Belgium

Huascar Espinoza, Key Digital Technologies Joint Undertaking, Belgium

Paolo Azzoni, Inside Industry Association, Netherlands

Inessa Seifert, EPoSS – European Platform of System Integrators, Germany

Luca Valcarenghi, Sant’Anna School of Advanced Studies, Italy

Emilio Paolini, Sant’Anna School of Advanced Studies, Italy

Konstantinos Georgopoulos, Technical University of Crete, Greece

Iakovos Mavroidis, Technical University of Crete, Greece

Fabian Chersi, CEA-LIST, France

Hana Krichene, CEA-LIST, France

Pavel Smrz, COGNITECHNA s.r.o., Czech Republic

Alain Pagani, German Research Center for Artificial Intelligence – DFKI, Germany

Alexandre Valentian, CEA-LIST, France

Andrea Dunbar, CSEM, Switzerland

Jochen Koszescha, Infineon, Germany

George Dimitrakopoulos, Infineon, Germany

Holger Schmidt, Infineon, Germany

Kay Bierzynski, Infineon, Germany

Roy Bahr, SINTEF, Norway

Ihsen Alouani, Université Polytechnique Hauts-De-France, France

Modris Greitans, Institute of Electronics and Computer Science, Latvia

Janis Arents, Institute of Electronics and Computer Science, Latvia

Andrea Acquaviva, University of Bologna, Italy

Francesco Barchi, University of Bologna, Italy

Paolo Meloni, University of Cagliari, Italy

Fetze Pijlman, Signify, Netherlands

Vincenzo Piuri, University of Milan, Italy

Fabio Scotti, University of Milan, Italy

Angelo Genovese, University of Milan, Italy

Marco Ottella, Xtremion Engineering Srls, Italy

Gleb Radchenko, Silicon Austria Labs, Austria

Kanishkan Vadivel, imec, Netherlands

Alberto Faro, DeepSensing, Italy

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